Dieffenbacher Group’s Wood-Based Panel Division has joined PELICE 2010 as a Gold Sponsor. The German-headquartered business, known for supplying turnkey plants to the worldwide panel industries, has been extremely aggressive in 2009 in expanding operations.
Earlier this year. Dieffenbacher assumed majority ownership of Shanghai Wood Based Panel Machinery, and most recently Dieffenbacher acquired B. Maier, a manufacturer of chips and particle preparation systems.
Also, Dieffenbacher announced it would supply a turnkey OSB plant to Hubei Baoyuan Group of China. In addition, Dieffenbacher is emphasizing its turnkey capabilities to supply wood pellet plants.
The Panel & Engineered Lumber International Conference & Expo is scheduled for February 4-6, 2010 at the Omni Hotel at CNN Center in downtown Atlanta, Georgia. The first PELICE was held in 2008 and attracted 90 speakers, 90 exhibitors and 600 registrants.
Other current Gold sponsors include The Teaford Company, TECO and Arclin.