Arclin, a vertically integrated supplier of resins and paper overlays, has joined the 2010 Panel & Engineered Lumber International Conference & Expo (PELICE) as a Gold sponsor. PELICE will be held February 4-6, 2010 at the Omni Hotel at CNN Center in Atlanta, Georgia. The first PELICE, held in 2008, attracted 600 registrants, 90 exhibitor companies and 90 speakers. PELICE is co-sponsored by Panel World magazine and Georgia Research Institute.
“We are most pleased that Arclin is providing the ultimate show of confidence in PELICE,” comments PELICE co-chairman and Panel World editor Rich Donnell. “We strongly believe they won’t be disappointed.”
In announcing its Gold commitment to PELICE, Arclin released the following statement:
“Our strength is our people and the desire to form long-term, strategic value chain partnerships adding value every day. Choosing the right partner can be the key to success in today’s tough markets where margins are tight and everyone can’t be the low cost producer.
“Our technical and product development teams are ready to assist our partners with new product and market development efforts so they can be leaders. Recent successes include our E-Gen designated ULEF resin systems for composite panels that can reach background emission levels of wood with minimal impact on operating windows and cost. Additionally, as the world leader in overlay technology, we are proud to be the exclusive treater of papers printed with Mossy Oak branded camouflage designs, bringing new choices to the decorative surfaces market.”
For information, contact:
Co-Chairman Fred Kurpiel, 678-642-1238; [email protected]
Co-Chairman Rich Donnell, 334-834-1170; rich@hattonbrowncom
Conference Coordinator Dianne Sullivan, 334-834-1170; [email protected]